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Mobile CPU chip

Features:
  • Mainly used in MiFi/mobile phone
  • Supporting: LTE CAT4, LTE-FDD2100/1800MHz,
    LTE-TDD2600/2600MHz, EVCO800MHz, WCDMA,
    UMTS2100/1900/850MHz, EGPRS/GSM850/900/1800/1900MHz
  • Compatible with global main-stream 2G/3G/4G network
  • Cross telecom-operators support
  • RAM can be extended to 32G
  • Supports connection of up to ten devices
  • Network Broadband up to 100M

Mobile CPU chip

Relevant parameters:
  • Technology:SMIC28PS
  • Die size (post-shrink):6.9 mm x 5.4 mm
  • Total instance number:Over 8 million
  • Total memory instance:over 1.2K
  • Total memory bits:30Mbit
  • Max core logic frequency:800MHz
  • Major blocks:
    - WD(WCDMA)
    - TD(TD_LTE)
    - LTE(LTE module)
    - ZSP(CPU)
    - R7(CPU,800MHz)
    - DDR(1GHz LPDDR2/3 PHY, Innosilicon IP)
    - USB2 PHY, Innosilicon IP
    - HSIC PHY, Innosilicon IP
    - Temperature Sensor, Innosilicon IP
Design Input:
  • Netlist
  • CPF/UPF
  • SDC
  • Clock structure
  • Dataflow
  • IO table
DFT:
  • Stuck-at test(cov: >97%)
  • Full at-speed Scan Test (cov: >75%)
  • Full at-speed Memory BIST test
Floorplan:
  • Memories
  • Multiple power domains division
  • Physical cells
  • MTCMOS
  • Power plan
Placement:
  • Scan Reorder
  • Timing-driven placement
CTS:
  • Clock Skew and latency optimization
  • First function clocks, then DFT clocks
  • Scan reorder
Routing:
  • Optimize VIA
  • Timing Optimize
  • Crosstalk Optimize
Timing Closure:
  • Leakage optimize
  • Clocktree ECO
  • Critical Path double space 、double width
  • Reduce Noise
Physical Verification:
  • DRC/ANT/LVS
  • ESD/ERC
  • DFM
Design Output:
  • GDS
  • Provide reports:
    - Timing
    - IR
    - PV reports
    - ATPG database